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Samsung Electronics announced the mass volume production of its 12-layer 36GB HBM3E memory, offering industry-leading bandwidth of up to 1,280 GB/s for next-generation generative AI hyperscale cloud systems.
KOREA TODAYSamsung Electronics Official Newsroom
Samsung Electronics Commences Volume Shipments of 12-Layer HBM3E Memory for AI Accelerators
Samsung Electronics announced the mass volume production of its 12-layer 36GB HBM3E memory, offering industry-leading bandwidth of up to 1,280 GB/s for next-generation generative AI hyperscale cloud systems.